Semiconductor module and method of manufacturing semiconductor module

ABSTRACT

A semiconductor module includes: a semiconductor device; a bonding layer that is arranged on the semiconductor device, contains nickel or copper, and is electrically connected to the semiconductor device; a solder portion containing gold, disposed on the bonding layer; and a protective layer disposed directly on the bonding layer, covering an outer peripheral edge of the bonding layer.

BACKGROUND OF THE INVENTION Technical Field

The present invention relates to a semiconductor module and a method ofmanufacturing the semiconductor module.

Background Art

Conventionally, semiconductor modules that include semiconductor devicesare used. Such semiconductor modules include a semiconductor device andan insulating substrate which supports the semiconductor device, andwires which connect the semiconductor device to an external unit aresolder-bonded to electrodes of the semiconductor device.

The semiconductor module includes a metal-oxide-semiconductorfield-effect transistor (MOSFET), an insulated-gate bipolar transistor(IGBT), a freewheeling diode (FWD), or the like as the semiconductordevice, for example.

Accordingly, semiconductor modules are subjected to thermal cyclingtests that simulate the usage environment in order to evaluatereliability.

In a semiconductor module, one of the locations upon which stress actsas a result of thermal cycling is a protective layer that protects theelectrodes to which wires that connect the semiconductor device to anexternal unit are solder-bonded.

The electrodes of the semiconductor device and the wires that areconnected to those electrodes are connected using solder. Moreover, thearea surrounding the electrodes is covered by the protective layer. Theprotective layer is made of a resin, while the electrodes to which theprotective layer adheres are made of metal, and therefore the degree ofthermal expansion of both materials is different.

The electrodes of the semiconductor device include a bonding layer whichis connected to the circuits of the semiconductor device and ananti-oxidation layer which is arranged on the bonding layer and preventsthe bonding layer from oxidizing.

For example, the bonding layer is made of nickel, the anti-oxidationlayer is made of gold, and the protective layer is made of a polyimide.In the electrodes to which wires are solder-bonded, the anti-oxidationlayer portions are covered by the protective layer.

The polyimide that is used for the protective layer exhibits lowadhesive strength with the gold forming the anti-oxidation layer, andtherefore subjecting the semiconductor device to thermal cycling testscreates stress on the plane of adhesion between the anti-oxidation layerand the protective layer, which can cause the protective layer to peelfrom the anti-oxidation layer and result in reduced insulation.

Therefore, Patent Document 1, for example, proposes interposing anamorphous silicon film which exhibits high adhesive strength withpolyimides between a polyimide forming a protective layer and analuminum film forming an electrode in order to improve the adhesivestrength between the polyimide and the aluminum film.

Moreover, Patent Document 2 proposes interposing a hexamethyldisilanefilm which exhibits high adhesive strength with polyimides between apolyimide forming a protective layer and an aluminum film forming anelectrode in order to improve the adhesive strength between thepolyimide and the aluminum film.

RELATED ART DOCUMENTS Patent Documents

Patent Document 1: Japanese Patent Application Laid-Open Publication No.2000-277512

Patent Document 2: Japanese Patent Application Laid-Open Publication No.2001-189309

SUMMARY OF THE INVENTION

In the technologies proposed in Patent Documents 1 and 2 as describedabove, when the material to which the polyimide adheres in theelectrodes of the semiconductor device is a material other thanaluminum, adhesion of the polyimide can potentially suffer.

The present specification aims to provide a semiconductor moduleincluding a protective layer which exhibits high bonding strength withan electrode.

Additional or separate features and advantages of the invention will beset forth in the descriptions that follow and in part will be apparentfrom the description, or may be learned by practice of the invention.The objectives and other advantages of the invention will be realizedand attained by the structure particularly pointed out in the writtendescription and claims thereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described, in oneaspect, the present disclosure provides a semiconductor module,comprising: a semiconductor device; a bonding layer that is arranged onthe semiconductor device, contains nickel or copper, and is electricallyconnected to the semiconductor device; a solder portion containing gold,disposed on the bonding layer; and a protective layer disposed directlyon the bonding layer, covering an outer peripheral edge of the bondinglayer.

In this semiconductor module, an outer peripheral edge of the solderportion may coincide with an inner peripheral edge of the protectivelayer.

Moreover, in this semiconductor module, an outer peripheral edge of thesolder portion may be positioned further inwards than an innerperipheral edge of the protective layer.

In particular, in this semiconductor module, between the outerperipheral edge of the solder portion and the inner peripheral edge ofthe protective layer, the bonding layer may be exposed.

Furthermore, in this semiconductor module, an arithmetic averageroughness of a surface of a portion of the bonding layer on which theprotective layer may be arranged be greater than or equal to 1 μm andless than or equal to 6 μm.

In addition, in this semiconductor module, the protective layer maycontain polyimide or polyamide.

In another aspect, the present disclosure provides a method ofmanufacturing a semiconductor module, comprising: forming, on asemiconductor device, a bonding layer containing nickel or copper so asto be electrically connected to the semiconductor device; forming ananti-oxidation layer that contains gold on the bonding layer except foron an outer peripheral portion of the bonding layer including an outerperipheral edge of the bonding layer; forming a protective layerdirectly on the bonding layer so as to cover the outer peripheral edgeof the bonding layer; and bonding a region of the bonding layer on whichthe anti-oxidation layer is formed to a wire using solder.

In this method of manufacturing a semiconductor module, the forming ofthe anti-oxidation layer may include: forming a layer that contains goldover an entire surface of the bonding layer; and removing a portion ofsaid layer containing gold that is on the outer peripheral portion ofthe bonding layer so as to form the anti-oxidation layer. Further, theremoving of the portion of said layer containing gold that is on theouter peripheral portion of the bonding layer may be performed so as tocause an exposed surface of the outer peripheral portion of the bondinglayer to have an arithmetic average roughness of greater than or equalto 1 μm and less than or equal to 6 μm.

In this method of manufacturing a semiconductor module, theanti-oxidation layer and the protective layer may be formed so that anouter peripheral edge of the anti-oxidation layer coincides with as aninner peripheral edge of the protective layer.

The semiconductor module disclosed in the present specification asdescribed above includes a protective layer which exhibits high bondingstrength with an electrode.

Moreover, the method of manufacturing a semiconductor module disclosedin the present specification as described above makes it possible toproduce a semiconductor module including a protective layer whichexhibits high bonding strength with an electrode. It is to be understoodthat both the foregoing general description and the following detaileddescription are exemplary and explanatory, and are intended to providefurther explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view of an embodiment of a semiconductor moduledisclosed in the present specification, and FIG. 1B is a cross-sectionalview taken along line X-X′.

FIG. 2 is a drawing for explaining bonding layers.

FIGS. 3A and 3B illustrate a modification example of the semiconductormodule disclosed in the present specification.

FIG. 4 illustrates a (first) step in an embodiment of a method ofmanufacturing the semiconductor module disclosed in the presentspecification.

FIG. 5 illustrates a (second) step in the embodiment of the method ofmanufacturing the semiconductor module disclosed in the presentspecification.

FIG. 6 illustrates a (third) step in the embodiment of the method ofmanufacturing the semiconductor module disclosed in the presentspecification.

FIG. 7 illustrates a (fourth) step in the embodiment of the method ofmanufacturing the semiconductor module disclosed in the presentspecification.

FIG. 8 illustrates a (fifth) step in the embodiment of the method ofmanufacturing the semiconductor module disclosed in the presentspecification.

FIG. 9 illustrates a (sixth) step in the embodiment of the method ofmanufacturing the semiconductor module disclosed in the presentspecification.

FIG. 10 illustrates a (seventh) step in the embodiment of the method ofmanufacturing the semiconductor module disclosed in the presentspecification.

DETAILED DESCRIPTION OF EMBODIMENTS

Next, preferred embodiments of a semiconductor module to be disclosed inthe present specification will be described with reference to figures.Note, however, that the technical scope of the present invention is notlimited to these embodiments and includes both the invention as setforth in the claims as well as equivalents thereof.

FIG. 1A is a plan view of an embodiment of a semiconductor moduledisclosed in the present specification, and FIG. 1B is a cross-sectionalview taken along line X-X′.

A semiconductor module 10 includes a semiconductor device 11 and aninsulating substrate 12 which supports the semiconductor device 11. Thesemiconductor module 10 includes a MOSFET as the semiconductor device11. Wires 20 a and 20 b which electrically connect the semiconductordevice 11 to an external unit are solder-bonded to the semiconductordevice 11. Moreover, the semiconductor module 10 may be housed within acasing (not illustrated in the figures). Note that in FIG. 1A, the wiresare not explicitly depicted.

The semiconductor device 11 includes a main device body 11 a, a sourceelectrode 11 b, a gate electrode 11 c, and a drain electrode 11 d. Thesource electrode 11 b and the gate electrode 11 c are arranged on afirst surface s1 of the main device body 11 a, and the drain electrode11 d is arranged on a second surface s2 of the main device body 11 a.

Moreover, on the first surface s1, the semiconductor module 10 includesa first protective layer 15 which covers portions other than where thesource electrode 11 b and the gate electrode 11 c are arranged. Thefirst protective layer 15 is electrically insulating and is made of apolyimide or a polyamide, for example.

The insulating substrate 12 supports the semiconductor device 11 anddissipates heat generated by the semiconductor device 11. The insulatingsubstrate 12 includes a main substrate 12 a, a circuit substrate 12 b,and a metal plate 12 c.

The main substrate 12 a is electrically insulating and thermallyconductive and provides mechanical strength for supporting thesemiconductor device 11. The main substrate 12 a is made of a ceramicsuch as aluminum nitride, for example.

Via a solder layer 12 d, the circuit substrate 12 b is electricallyconnected to the drain electrode 11 d and bonds the semiconductor device11 to the insulating substrate 12. Here, the circuit substrate 12 b maybe a copper plate which electrically connects wiring (not illustrated inthe figure) to the drain electrode 11 d. The circuit substrate 12 b iselectrically connected to a unit external to the semiconductor device 11via wiring (not illustrated in the figure).

The metal plate 12 c is bonded to a chassis or the like (not illustratedin the figure) to fix the semiconductor module 10 to the chassis andalso conducts heat generated by the semiconductor module 10 to thechassis. The metal plate 12 c is made of a metal with high thermalconductivity such as copper, for example.

The dimensions of the main substrate 12 a can be determined asappropriate based on the dimensions of the semiconductor device 11. Forexample, when the dimensions of the semiconductor device 11 are 10 mm inlength by 10 mm in width by 1 mm in thickness, the dimensions of themain substrate 12 a may be set to 30 mm in length by 30 mm in width by0.5 mm in thickness, and the dimensions of the metal plate 12 c may beset to 25 mm in length by 25 mm in width by 1 mm in thickness.

The semiconductor module 10 includes a first electrode structure 10 awhich electrically connects the source electrode 11 b of thesemiconductor device 11 and the wire 20 a as well as a second electrodestructure 10 b which electrically connects the gate electrode 11 c ofthe semiconductor device 11 and the wire 20 b. The outer periphery ofthe source electrode 11 b is covered by the protective layer 15, and aninterior portion which is not covered by the protective layer 15 forms arecess. Similarly, the gate electrode 11 c is arranged within a recesssurrounded by the protective layer 15. The outer peripheries of thesource electrode 11 b and the gate electrode 11 c may be covered by theprotective layer 15 but do not necessarily need to be covered. Theoutlines of the recesses may take any shape, including circular shapes,but from a practical perspective it is preferable that these shapes berectangular when viewed in a plan view. Here, the outlines of therecesses will be described as being rectangular in shape. Similarly, abonding layer 14 a and a bonding layer 14 b (described later) may alsotake any shape, including circular shapes, but from a practicalperspective it is preferable that these shapes be rectangular whenviewed in a plan view, and therefore here these shapes will be describedas being rectangular.

Next, the first electrode structure 10 a will be described below. Thefirst electrode structure 10 a includes the bonding layer 14 a and asolder portion 17 a. The bonding layer 14 a is electrically conductiveand is electrically connected to inside of the semiconductor device 11via the source electrode 11 b. The bonding layer 14 a has a rectangularshape when viewed in a plan view and is arranged on top of and near thecenter of the source electrode 11 b. The source electrode 11 b is madeof aluminum or an aluminum alloy, for example.

It is preferable that the thickness of the source electrode 11 b be inthe range of 3 μm to 6 μm. Setting the thickness of the source electrode11 b to at least 3 μm makes it possible to achieve sufficient electricalproperties and mechanical strength as a conductor layer. Moreover, ifthe thickness of the source electrode 11 b is greater than 6 μm, warpingof the source electrode 11 b can result in stress on the main devicebody 11 a.

The bonding layer 14 a of the first electrode structure 10 a is arrangedon the source electrode 11 b and is electrically connected to the sourceelectrode 11 b. The bonding layer 14 a is interposed in the solder bondbetween the source electrode 11 b and the solder portion 17 a. Thebonding layer 14 a is rectangular when viewed in a plan view, and theperiphery thereof is covered by the protective layer 15. The bondinglayer 14 a is made of nickel, a nickel alloy, copper, or a copper alloy.

As illustrated in FIG. 2 , the bonding layer 14 a includes a firstregion 14 a 1 which is arranged along the outer peripheral edge and asecond region 14 a 2 which is arranged on the inner side of the firstregion 14 a 1. In the semiconductor module 10, the first region 14 a 1and the second region 14 a 2 contact one another. In other words, thefirst region 14 a 1 is a region arranged along the outer peripheral edgeof the bonding layer 14 a, and the second region 14 a 2 is the region onthe inner side of the first region 14 a 1.

The first region 14 a 1 is a region covered by a protective layer 16(described later). The second region 14 a 2 is the region in which thesolder portion 17 a is arranged.

The first region 14 a 1 has a prescribed width and is arranged along theouter peripheral edge of the bonding layer 14 a. From the perspective ofbonding the second protective layer 16 to the bonding layer 14 a withsufficient bonding strength, it is preferable that the width of thefirst region 14 a 1 be at least 30 μm. The upper limit for the width ofthe first region 14 a 1 can be determined as appropriate based on thedimensions of the bonding layer 14 a or the solder portion 17 a.

Moreover, from the perspective of bonding the second protective layer 16(described later) with sufficient strength to the bonding layer 14 a byvirtue of mating with irregularities in the surface of the first region14 a 1, it is preferable that the arithmetic average roughness of thesurface of the first region 14 a 1 be greater than or equal to 1 μm andless than or equal to 6 μm.

It is preferable that the thickness of the bonding layer 14 a be in therange of 3 μm to 6 μm. Setting the thickness of the bonding layer 14 ato at least 3 μm makes it possible to achieve sufficient electricalproperties and mechanical strength as a conductor layer. Moreover, ifthe thickness of the bonding layer 14 a is greater than 6 μm, warping ofthe bonding layer 14 a can result in stress on the semiconductor device11.

The solder portion 17 a of the first electrode structure 10 a isarranged on the second region 14 a 2 of the bonding layer 14 a and iselectrically connected to the bonding layer 14 a. Moreover, the solderportion 17 a electrically connects the bonding layer 14 a and the wire20 a. The solder portion 17 a is made of a solder containing gold.Furthermore, the solder portion 17 a may be an alloy into which thematerial forming the bonding layer 14 a mixes when soldered to thebonding layer 14 a.

Next, the second electrode structure 10 b will be described below. Thesecond electrode structure 10 b includes the bonding layer 14 b and asolder portion 17 b. The bonding layer 14 b is electrically conductiveand is electrically connected to the semiconductor device 11 via thegate electrode 11 c. The bonding layer 14 b has a rectangular shape whenviewed in a plan view and has the same outline as the gate electrode 11c. The gate electrode 11 c is made of aluminum or an aluminum alloy, forexample. The above description of the thickness of the source electrode11 b of the first electrode structure 10 a can also be applied to thegate electrode 11 c as appropriate.

The bonding layer 14 b of the second electrode structure 10 b isarranged on the gate electrode 11 c and is electrically connected to thegate electrode 11 c. The bonding layer 14 b is interposed in the solderbond between the gate electrode 11 c and the solder portion 17 b. Thebonding layer 14 b has a rectangular shape when viewed in a plan viewand has the same outline as the gate electrode 11 c. The bonding layer14 b is made of nickel, a nickel alloy, copper, or a copper alloy.

As illustrated in FIG. 2 , the bonding layer 14 b includes a firstregion 14 b 1 which is arranged along the outer peripheral edge and asecond region 14 b 2 which is arranged on the inner side of the firstregion 14 b 1.

The first region 14 b 1 is a region covered by the protective layer 16.The second region 14 b 2 is the region in which the solder portion 17 bis arranged.

The above description of the first region 14 a 1 and the second region14 a 2 of the bonding layer 14 a of the first electrode structure 10 acan also be applied to the first region 14 b 1 and the second region 14b 2 of the second electrode structure 10 b as appropriate.

Moreover, the above description of the thickness of the bonding layer 14a of the first electrode structure 10 a can also be applied to thebonding layer 14 b of the second electrode structure 10 b asappropriate.

The solder portion 17 b of the second electrode structure 10 b isarranged on the second region 14 b 2 of the bonding layer 14 b and iselectrically connected to the bonding layer 14 b. Moreover, the solderportion 17 b electrically connects the bonding layer 14 b and the wire20 b. The solder portion 17 b is made of a solder containing gold.Furthermore, the solder portion 17 b may be an alloy into which thematerial forming the bonding layer 14 b mixes when soldered to thebonding layer 14 b.

The semiconductor module 10 includes the second protective layer 16,which covers a region excluding the solder portions 17 a and 17 b on thefirst surface s1 of the semiconductor device 11.

The second protective layer 16 is arranged directly on the first region14 a 1 of the bonding layer 14 a of the first electrode structure 10 aand covers the outer peripheral edge of the bonding layer 14 a. A secondregion 14 a 2-side edge 16 a of the second protective layer 16 isarranged on the first region 14 a 1 and contacts an edge 17 a 1 of thesolder portion 17 a. In other words, the inner peripheral edge of thesecond protective layer 16 contacts the outer peripheral edge of thesolder portion 17 a. As illustrated by the hatching in FIG. 1A, thesecond protective layer 16 bonds (adheres) to the surface of the firstregion 14 a 1 via a bonding surface 16 a 1 between the second protectivelayer 16 and the first region 14 a 1. The bonding surface 16 a 1 has aring-shaped shape which surrounds the solder portion 17 a.

Moreover, the second protective layer 16 is arranged directly on thefirst region 14 b 1 of the bonding layer 14 b of the second electrodestructure 10 b and covers the outer peripheral edge of the bonding layer14 b. A second region 14 b 2-side edge 16 b of the second protectivelayer 16 is arranged on the first region 14 b 1 and contacts an edge 17b 1 of the solder portion 17 b. In other words, the inner peripheraledge of the second protective layer 16 contacts the outer peripheraledge of the solder portion 17 b. As illustrated by the hatching in FIG.1A, the second protective layer 16 bonds (adheres) to the surface of thefirst region 14 b 1 via a bonding surface 16 b 1 between the secondprotective layer 16 and the first region 14 b 1. The bonding surface 16b 1 has a ring-shaped shape which surrounds the solder portion 17 b.

The second protective layer 16 is electrically insulating and is made ofa polyimide or a polyamide, for example.

In the semiconductor module according to the present embodiment asdescribed above, the respective bonding layers of the first electrodestructure and the second electrode structure exhibit high bondingstrength with the second protective layer, thereby preventing the secondprotective layer from peeling from the bonding layers. Therefore, thefirst electrode structure and the second electrode structure areprotected by the second protective layer, and the electrical insulationproperties are also maintained, which improves the reliability of thesemiconductor module.

When the semiconductor device undergoes warping as a result oftemperature changes or the like in the semiconductor module 10, forexample, shear stress can occur between the second protective layer andthe surfaces of the first regions of the bonding layers. The secondprotective layer is bonded (adhered) to the surfaces of the firstregions by the bonding surfaces between the second protective layer andthe first regions, and therefore the shear stress applied per unit areaof the bonding surface between the second protective layer and the firstregions of the bonding layers is small, which makes the secondprotective layer less prone to peeling from the first surfaces of thebonding layers.

Next, a modification example of the semiconductor module according tothe present embodiment as described above will be described below withreference to FIGS. 3A and 3B.

FIGS. 3A and 3B illustrates a modification example of the semiconductormodule disclosed in the present specification. In a semiconductor module10 according to the present modification example, in the first electrodestructure 10 a the second region 14 a 2-side edge 16 a of the secondprotective layer 16 and the edge 17 a 1 of the solder portion 17 a areseparated from one another, and the bonding layer 14 a is exposedbetween these edges. In other words, the inner peripheral edge of thesecond protective layer 16 and the outer peripheral edge of the solderportion 17 a are separated, and the bonding layer 14 a is exposedbetween these edges. This is to say that the first region 14 a 1 and thesecond region 14 a 2 are separated from one another.

In this case, in the region in which the bonding layer 14 a is exposed,the bonding layer 14 a is exposed to the atmosphere and undergoesoxidation, which inhibits wetting and spreading of solder.

During manufacture of the semiconductor module 10, arranging the secondregion 14 a 2-side edge 16 a of the second protective layer 16 and theedge 17 a 1 of the solder portion 17 a to be separated from one another(that is, arranging the inner peripheral edge of the second protectivelayer 16 and the outer peripheral edge of the solder portion 17 a to beseparated from one another) makes it possible to allocate margin interms of placement accuracy when forming the second protective layer 16and/or the solder portion 17 a. This makes it possible to reduce thetime and cost of the manufacturing process.

Moreover, in the second electrode structure 10 b, the second region 14 b2-side edge 16 b of the second protective layer 16 and the edge 17 b 1of the solder portion 17 b are separated from one another, and thebonding layer 14 b is exposed between these edges. In other words, theinner peripheral edge of the second protective layer 16 and the outerperipheral edge of the solder portion 17 b are arranged so as to beseparated from one another, which achieves the same advantageous effectas described above. The rest of the configuration of the presentmodification example is the same as in the embodiment described above.

Next, a preferred embodiment of a method of manufacturing thesemiconductor module described above will be described below withreference to FIGS. 4 to 10 .

First, as illustrated in FIG. 4 , a semiconductor device 11 including asource electrode 11 b, a gate electrode 11 c, and a drain electrode 11 dis prepared. Aluminum or an aluminum alloy can be used as the materialfor the source electrode 11 b and the gate electrode 11 c, for example.The source electrode 11 b and the gate electrode 11 c may be 5 μm inthickness, for example. Although only a single semiconductor device 11is depicted in FIG. 4 , the semiconductor device 11 is prepared in aform in which a plurality of semiconductor devices 11 are arranged on asingle wafer. The following steps will be described for a singlesemiconductor device 11, but the same processes are also applied to theother semiconductor devices.

Next, as illustrated in FIG. 5 , a first protective layer 15 is formedon the semiconductor device 11, thereby yielding a semiconductorstructure 30. The first protective layer 15 is formed on a first surfaces1 of the semiconductor device 11 so as to leave the source electrode 11b and the gate electrode 11 c exposed. The first protective layer 15 maycover the outer peripheries of the source electrode 11 b and the gateelectrode 11 c. Whether the first protective layer 15 covers or does notcover the outer peripheries of the source electrode 11 b and the gateelectrode 11 c may be selected as appropriate on the basis of the sizesof the source electrode 11 b and the gate electrode 11 c. Here, a casein which the outer periphery of the source electrode 11 b is covered bythe first protective layer 15 while the outer periphery of the gateelectrode is not covered by the first protective layer 15 will bedescribed. The first protective layer 15 is formed, for example, byapplying a liquid polyimide or polyamide to the first surface s1 of thesemiconductor device 11 so as to leave the source electrode 11 b and thegate electrode 11 c exposed and then applying heat to harden thismaterial.

Next, as illustrated in FIG. 6 , a bonding layer 14 a is formed on thesource electrode 11 b, and a bonding layer 14 b is formed on the gateelectrode 11 c. The bonding layer 14 a and the bonding layer 14 b areformed using a plating technology such as electroless plating, forexample. It is preferable that the bonding layer 14 a and the bondinglayer 14 b be made of nickel, a nickel alloy, copper, or a copper alloy.More specifically, the bonding layer 14 a and the bonding layer 14 b maybe formed as nickel phosphorus films using an electroless platingtechnology. The thickness of the bonding layer 14 a and the bondinglayer 14 b may be set to 5 μm, for example.

Next, as illustrated in FIG. 7 , an anti-oxidation layer 18 a is formedon the bonding layer 14 a, and an anti-oxidation layer 18 b is formed onthe bonding layer 14 b. The anti-oxidation layer 18 a and theanti-oxidation layer 18 b prevent the bonding layer 14 a and the bondinglayer 14 b from oxidizing. The anti-oxidation layer 18 a and theanti-oxidation layer 18 b are formed as gold or gold alloy films using aplating technology such as electroless plating, for example. It ispreferable that the thickness of the anti-oxidation layer 18 a and theanti-oxidation layer 18 b be set in the range of 0.025 μm to 0.1 μm. Athickness of 0.025 μm ensures a thickness that makes it possible toprevent the bonding layer 14 a and the bonding layer 14 b fromoxidizing. Moreover, a thickness of no more than 0.1 μm makes itpossible to reduce material costs and maintain a uniform thickness.

Next, as illustrated in FIG. 8 , the anti-oxidation layer 18 a on afirst region 14 a 1 of the bonding layer 14 a is removed, and the firstregion 14 a 1 of the bonding layer 14 a is exposed. Similarly, theanti-oxidation layer 18 b on a first region 14 b 1 of the bonding layer14 b is removed, and the first region 14 b 1 of the bonding layer 14 bis exposed. More specifically, a first mask (not illustrated in thefigure) is formed on the first surface s1 of the semiconductor device 11so as to leave only the anti-oxidation layer 18 a on the first region 14a 1 of the bonding layer 14 a and the anti-oxidation layer 18 b on thefirst region 14 b 1 of the bonding layer 14 b exposed, and the portionsof the anti-oxidation layer 18 that are exposed from the first mask areremoved by etching. A wet etching process or a dry etching process suchas plasma etching can be used for this etching. Moreover, as analternative to etching, a blasting process may be used to remove theportions of the anti-oxidation layer 18 on the bonding layer 14 a andthe bonding layer 14 b that are exposed from the mask. Alternatively,laser irradiation may be used to remove the portion of theanti-oxidation layer 18 a on the first region 14 a 1 of the bondinglayer 14 a and the portion of the anti-oxidation layer 18 b on the firstregion 14 b 1 of the bonding layer 14 b.

It is preferable that the etching conditions, the particle size ofparticles used in a blasting process, the laser irradiation conditions,or the like described above be adjusted such that the arithmetic averageroughness of the surface of the first region 14 a 1 and the first region14 b 1 is greater than or equal to 1 μm and less than or equal to 6 μm.This allows a second protective layer 16 to mate with irregularitiesformed in the surfaces of the first region 14 a 1 and the first region14 b 1, thereby increasing the bonding strength of the second protectivelayer 16 with these regions.

Next, as illustrated in FIG. 9 , the second protective layer 16 isformed on the first region 14 a 1 of the bonding layer 14 a so as tocover the outer peripheral edge of the bonding layer 14 a, and thesecond protective layer 16 is also formed on the first region 14 b 1 ofthe bonding layer 14 b so as to cover the outer peripheral edge of thebonding layer 14 b. The second protective layer 16 is formed coveringthe first protective layer 15 on the first surface s1 of thesemiconductor device 11 so as to leave only the second region 14 a 2 ofthe bonding layer 14 a and the second region 14 b 2 of the bonding layer14 b exposed. Here, it is preferable that the second protective layer 16be formed so as to not cover onto the anti-oxidation layer 18 a and theanti-oxidation layer 18 b. This is because if the second protectivelayer 16 covers onto the anti-oxidation layer 18 a and theanti-oxidation layer 18 b, solder portions 17 a and 17 b (describedlater) become more difficult to bond to the second regions 14 a 2 and 14b 2 of the bonding layers 14 a and 14 b.

The second protective layer 16 can be formed as follows, for example. Ina first method, a second mask (not illustrated in the figures) is formedcovering the first mask on the anti-oxidation layer 18 a and theanti-oxidation layer 18 b. Here, the second mask is formed so as tocover a portion of the first region 14 a 1 of the bonding layer 14 a ona second region 14 a 2-side as well as a portion of the first region 14b 1 of the bonding layer 14 b on a second region 14 b 2-side. Then, thefirst mask that is not covered by the second mask is removed. Next, withthe second region 14 a 2 of the anti-oxidation layer 18 a and the secondregion 14 b 2 of the anti-oxidation layer 18 b covered by the firstmask, a liquid polyimide or polyamide may be applied to the firstsurface s1 of the semiconductor device 11 using a spin coating process,and then heat may be applied to harden this material and form the secondprotective layer 16. The heating conditions can be set to one hour at350° C., for example. Then, the first mask is removed from on theanti-oxidation layer 18 a and the anti-oxidation layer 18 b.

In a second method, after removing the first mask used in the step inFIG. 8 , a photosensitive polyimide or polyamide is applied to the firstsurface s1 of the semiconductor device 11 and then patterned andtemporarily cured to form the second protective layer 16 on the firstsurface s1 of the semiconductor device 11. Then, the temporarily curedsecond protective layer 16 may be heated and fully cured to form thesecond protective layer 16.

In a third method, after removing the first mask used in the step inFIG. 8 , a liquid polyimide or polyamide may be applied to a prescribedregion on the first surface s1 of the semiconductor device 11 using aninkjet process and may then be heated and fully cured to form the secondprotective layer 16. Then, the plurality of semiconductor structures 30formed on the single wafer are cut into individual semiconductorstructures 30.

Next, as illustrated in FIG. 10 , in the semiconductor structure 30, thedrain electrode 11 d of the semiconductor device 11 is bonded onto acircuit substrate 12 b of an insulating substrate 12 via a solder layer12 d.

Then, as illustrated in FIGS. 1A and 1B, a solder portion 17 a is formedby using solder to electrically bond a wire 20 a and the second region14 a 2 of the bonding layer 14 a in which the anti-oxidation layer 18 ais arranged. The anti-oxidation layer 18 a melts into the solder andbecomes part of the solder portion 17 a. In other words, once thishappens the solder portion 17 a contains gold. Similarly, a solderportion 17 b is formed by using solder to electrically bond a wire 20 band the second region 14 b 2 of the bonding layer 14 b in which theanti-oxidation layer 18 b is arranged. The anti-oxidation layer 18 bmelts into the solder and becomes part of the solder portion 17 b.Completing the steps described above yields the semiconductor module 10.Moreover, when using the solder portion 17 a to bond together thebonding layer 14 a and the wire 20 a, if a portion of the bonding layer14 a is exposed on the surface, the surface of the bonding layer 14 a isexposed to the atmosphere and undergoes oxidation, which inhibitswetting and spreading of the solder. In this case, the positions of theouter peripheral edge of the solder portion 17 a and the outerperipheral edge of the anti-oxidation layer 18 a match one another.Here, the “portion of the bonding layer 14 a that is exposed on thesurface” refers to the region sandwiched between the inner peripheraledge of the protective layer 16 and the outer peripheral edge of thesolder portion 17 a (or the outer peripheral edge of the anti-oxidationlayer 18 a) in the modification example of the semiconductor moduleaccording to the embodiment described above.

In the method of manufacturing the semiconductor module according to thepresent embodiment as described above, the second protective layer 16 isformed directly on top of the first regions 14 a 1 and 14 b 1 of thebonding layers 14 a and 14 b but is not formed on the second regions 14a 2 and 14 b 2 of the bonding layers 14 a and 14 b, thereby forming asecond protective layer 16 that exhibits high bonding strength with thebonding layers 14 a and 14 b.

In the present invention, the semiconductor module and method ofmanufacturing a semiconductor module according to the embodimentsdescribed above can be modified as appropriate without departing fromthe spirit of the present invention.

For example, although the semiconductor module according to theembodiments described above includes a MOSFET as a semiconductor device,the semiconductor device is not limited to this example. Thesemiconductor module may include a semiconductor device such as an IGBTor FWD as the semiconductor device, for example.

Moreover, although in the semiconductor module according to theembodiments described above a bonding layer is arranged on the sourceelectrode of the semiconductor device, an electrode layer made of aconductor may be arranged between the source electrode and the bondinglayer. The material and thickness of this conductor may be the same asthose used for the source electrode. Similarly, an electrode layer madeof a conductor may be arranged between the gate electrode of thesemiconductor device and the respective bonding layer. The material andthickness of this conductor may be the same as those used for the gateelectrode.

Furthermore, although in the semiconductor module according to theembodiments described above the second protective layer that protectsthe first electrode structure and the second electrode structure isshared therebetween, protective layers that protect the first electrodestructure and the second electrode structure may be separate members.

In addition, although in the method of manufacturing the semiconductormodule according to the embodiments described above the protective layeris formed on the first regions of the bonding layers so as to cover theouter peripheral edges of the bonding layers and then the second regionsof the bonding layers in which the anti-oxidation layers are arrangedare electrically bonded to wires using solder, the order of these stepsmay be reversed.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the invention. Thus, it isintended that the present invention cover modifications and variationsthat come within the scope of the appended claims and their equivalents.In particular, it is explicitly contemplated that any part or whole ofany two or more of the embodiments and their modifications describedabove can be combined and regarded within the scope of the presentinvention.

What is claimed is:
 1. A method of manufacturing a semiconductor module,comprising: forming, on a semiconductor device, a bonding layercontaining nickel or copper so as to be electrically connected to thesemiconductor device; forming an anti-oxidation layer that contains goldon the bonding layer except for on an outer peripheral portion of thebonding layer including an outer peripheral edge of the bonding layer;forming a protective layer directly on the bonding layer so as to coverthe outer peripheral edge of the bonding layer; and bonding a region ofthe bonding layer on which the anti-oxidation layer is formed to a wireusing solder, wherein the bonding of the region of the bonding layer onwhich the anti-oxidation layer is formed to the wire using the soldercauses the anti-oxidation layer to be dissolved in the solder.
 2. Themethod according to claim 1, wherein the forming of the anti-oxidationlayer includes: forming a layer that contains gold over an entiresurface of the bonding layer; and removing a portion of said layercontaining gold that is on the outer peripheral portion of the bondinglayer so as to form the anti-oxidation layer.
 3. The method according toclaim 1, wherein the anti-oxidation layer and the protective layer areformed so that an outer peripheral edge of the anti-oxidation layercoincides with as an inner peripheral edge of the protective layer. 4.The method according to claim 1, wherein the anti-oxidation layer andthe protective layer are formed so that an outer peripheral edge of theanti-oxidation layer is positioned further inwards than an innerperipheral edge of the protective layer.
 5. The method according toclaim 2, wherein the removing of the portion of said layer containinggold that is on the outer peripheral portion of the bonding layer causesan exposed surface of the outer peripheral portion of the bonding layerto have an arithmetic average roughness of greater than or equal to 1 μmand less than or equal to 6 μm.
 6. The method according to claim 3,wherein the forming of the anti-oxidation layer includes: forming alayer that contains gold over an entire surface of the bonding layer;and removing a portion of said layer containing gold that is on theouter peripheral portion of the bonding layer so as to form theanti-oxidation layer, and wherein the removing of the portion of saidlayer containing gold that is on the outer peripheral portion of thebonding layer causes an exposed surface of the outer peripheral portionof the bonding layer to have an arithmetic average roughness of greaterthan or equal to 1 μm and less than or equal to 6 μm.
 7. The methodaccording to claim 4, wherein the forming of the anti-oxidation layerincludes: forming a layer that contains gold over an entire surface ofthe bonding layer; and removing a portion of said layer containing goldthat is on the outer peripheral portion of the bonding layer so as toform the anti-oxidation layer, and wherein the removing of the portionof said layer containing gold that is on the outer peripheral portion ofthe bonding layer causes an exposed surface of the outer peripheralportion of the bonding layer to have an arithmetic average roughness ofgreater than or equal to 1 μm and less than or equal to 6 μm.
 8. Amethod of manufacturing a semiconductor module, comprising: forming, ona semiconductor device, a bonding layer containing nickel or copper soas to be electrically connected to the semiconductor device; forming ananti-oxidation layer that contains gold on the bonding layer except foron an outer peripheral portion of the bonding layer including an outerperipheral edge of the bonding layer; forming a protective layerdirectly on the bonding layer so as to cover the outer peripheral edgeof the bonding layer; and bonding a region of the bonding layer on whichthe anti-oxidation layer is formed to a wire using solder, wherein theforming of the anti-oxidation layer includes: forming a layer thatcontains gold over an entire surface of the bonding layer; and removinga portion of said layer containing gold that is on the outer peripheralportion of the bonding layer so as to form the anti-oxidation layer. 9.The method according to claim 8, wherein the anti-oxidation layer andthe protective layer are formed so that an outer peripheral edge of theanti-oxidation layer coincides with as an inner peripheral edge of theprotective layer.
 10. The method according to claim 8, wherein theanti-oxidation layer and the protective layer are formed so that anouter peripheral edge of the anti-oxidation layer is positioned furtherinwards than an inner peripheral edge of the protective layer.
 11. Themethod according to claim 8, wherein the removing of the portion of saidlayer containing gold that is on the outer peripheral portion of thebonding layer causes an exposed surface of the outer peripheral portionof the bonding layer to have an arithmetic average roughness of greaterthan or equal to 1 μm and less than or equal to 6 μm.
 12. The methodaccording to claim 9, wherein the removing of the portion of said layercontaining gold that is on the outer peripheral portion of the bondinglayer causes an exposed surface of the outer peripheral portion of thebonding layer to have an arithmetic average roughness of greater than orequal to 1 μm and less than or equal to 6 μm.
 13. The method accordingto claim 10, wherein the removing of the portion of said layercontaining gold that is on the outer peripheral portion of the bondinglayer causes an exposed surface of the outer peripheral portion of thebonding layer to have an arithmetic average roughness of greater than orequal to 1 μm and less than or equal to 6 μm.
 14. A method ofmanufacturing a semiconductor module, comprising: forming, on asemiconductor device, a bonding layer containing nickel or copper so asto be electrically connected to the semiconductor device, an entire backsurface of the bonding layer being electrically connected to and indirect contact with an electrode in the semiconductor device; forming ananti-oxidation layer that contains gold on the bonding layer except foron an outer peripheral portion of the bonding layer including an outerperipheral edge of the bonding layer; forming a protective layerdirectly on the bonding layer so as to cover the outer peripheral edgeof the bonding layer; and bonding a region of the bonding layer on whichthe anti-oxidation layer is formed to a wire using solder, wherein theprotective layer is disposed directly on a top surface of the outerperipheral portion of the bonding layer on which the solder portion isabsent, covering the outer peripheral edge of the bonding layer, andwherein the protective layer contains polyimide or polyamide.
 15. Themethod according to claim 14, wherein the forming of the anti-oxidationlayer includes: forming a layer that contains gold over an entiresurface of the bonding layer; and removing a portion of said layercontaining gold that is on the outer peripheral portion of the bondinglayer so as to form the anti-oxidation layer.
 16. The method accordingto claim 14, wherein the anti-oxidation layer and the protective layerare formed so that an outer peripheral edge of the anti-oxidation layercoincides with as an inner peripheral edge of the protective layer. 17.The method according to claim 14, wherein the anti-oxidation layer andthe protective layer are formed so that an outer peripheral edge of theanti-oxidation layer is positioned further inwards than an innerperipheral edge of the protective layer.
 18. The method according toclaim 14, wherein the bonding of the region of the bonding layer onwhich the anti-oxidation layer is formed to the wire using the soldercauses the anti-oxidation layer to be dissolved in the solder.
 19. Themethod according to claim 15, wherein the removing of the portion ofsaid layer containing gold that is on the outer peripheral portion ofthe bonding layer causes an exposed surface of the outer peripheralportion of the bonding layer to have an arithmetic average roughness ofgreater than or equal to 1 μm and less than or equal to 6 μm.
 20. Themethod according to claim 16, wherein the forming of the anti-oxidationlayer includes: forming a layer that contains gold over an entiresurface of the bonding layer; and removing a portion of said layercontaining gold that is on the outer peripheral portion of the bondinglayer so as to form the anti-oxidation layer, and wherein the removingof the portion of said layer containing gold that is on the outerperipheral portion of the bonding layer causes an exposed surface of theouter peripheral portion of the bonding layer to have an arithmeticaverage roughness of greater than or equal to 1 μm and less than orequal to 6 μm.